Duplo has launched into the digital packaging market with its first B2 die-cutter, the DSM-1000 that can cut shapes, matrix crease, perforate and kiss cut automatically while separating and removing waste. Configurable with feeder, stacker, and separator units, the machine is operated through a panel and PC controller software, reaching up to 3,100sph on sheets up to 530x750mm.
Without separator, the machine can handle fine stocks up to 209.3gsm, coated stocks up to 279gsm, clay-coated up to 600 gsm, and chipboard paper up to 650gsm. However, with separator, the values are slightly lower, with fine and chipboard papers required to pass through only. You can see live demonstrations of DSM-1000 at Duplo’s 1,000sqm stand during drupa (Hall 17, Stand A01-2).
